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Package SMD or Through Hole SAMSUNG KLMAG4FEJA-A001 New original parts

Package SMD or Through Hole EMMC KLMAG4FEJA-A002 New original parts

Package SMD or Through Hole SAMSUNG KLMAG8DEDD-B New original parts

Package BGA SAMSUNG KLMAG8DEDD-B010 New original parts

Package SMD or Through Hole SAMSUNG KLMAG8DEDD-B101 New original parts

Package SMD or Through Hole SAMSUNG KLMAG8DEDD-B101000 New original parts

Package BGA SAMSUNG KLMAG8DEFD-A301 New original parts

Package SMD or Through Hole SAMSUNG KLMAG8DEFD-A301000 New original parts

Package SMD or Through Hole Samsung KLMAG8DEFD-A301T00 New original parts

eMMC 5.1 32 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production

eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production

eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production

eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production

eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production

eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production

eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production

eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production

eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production

eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Sample

eMMC 5.1 64 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production